Samsung DDR4 8G 3200 CL21 UDIMM M378A1K43EB2-CWE. Unbuffered DIMM DDR5 | No buffer or register: smaller latency value | Supports x8/x16 Organization / up to 2 ranks per DIMM and 2DPC configuration | For Desktop
Corsair DDR4 8GB 3200 CL16 Vengence LPX CMK8GX4M1Z3200C16 memory is designed for high-performance overclocking. The heatspreader is made of pure aluminum for faster heat dissipation, and the eight-layer PCB helps manage heat and provides superior overclocking headroom.
Corsair DDR4 16GB 3200 CL16 Vengeance LPX Bulk (CM4X16GC3200C16K2E) CMK16GX4M1E3200C16-B memory is designed for high-performance overclocking. The heatspreader is made of pure aluminum for faster heat dissipation, and the eight-layer PCB helps manage heat and provides superior overclocking headroom.
Corsair Vengeance LPX DDR4 16G 3200 CL16 memory is designed for high-performance overclocking. The heatspreader is made of pure aluminum for faster heat dissipation, and the eight-layer PCB helps manage heat and provides superior overclocking headroom. CMK16GX4M1E3200C16
Corsair DDR4 16G 3600 CL18 Vengeance LPX memory is designed for high-performance overclocking. The heatspreader is made of pure aluminum for faster heat dissipation, and the eight-layer PCB helps manage heat and provides superior overclocking headroom. CMK16GX4M1Z3600C18
Corsair DDR4 16G (2x8G) 3200 CL16 Vengeance LPX memory is designed for high-performance overclocking. The heatspreader is made of pure aluminum for faster heat dissipation, and the eight-layer PCB helps manage heat and provides superior overclocking headroom. CMK16GX4M2E3200C16
Corsair DDR4 16G (2x8G) 3600 CL18 Vengeance LPX memory is designed for high-performance overclocking. The heatspreader is made of pure aluminum for faster heat dissipation, and the eight-layer PCB helps manage heat and provides superior overclocking headroom. CMK16GX4M2Z3600C18
Corsair DDR4 16G (2x8G) 3600 CL18 Vengeance LPX memory is designed for high-performance overclocking. The heatspreader is made of pure aluminum for faster heat dissipation, and the eight-layer PCB helps manage heat and provides superior overclocking headroom. CMK16GX4M2D3600C18